#<p><strong><a href="http://www.techeye.net/wp-content/uploads/2015/05/Screen-Shot-2015-05-20-at-14.51.58-e1432129994443.png"><img class="alignleft size-medium wp-image-158696" src="http://www.techeye.net/wp-content/uploads/2015/05/Screen-Shot-2015-05-20-at-14.51.58-300x201.png" alt="William Xu, Huawei" width="300" height="201" /></a>Details of Huawei’s </strong>upcoming Kirin 950 chipset are starting to appear and it looks like it will be a tough one for the mobile industry to beat.</p>
<p>The chipset is one of the first to use TSMC’s 16nm FinFET Plus process for improved efficiency.… <a href="http://www.techeye.net/chips/huaweis-next-chipset-will-be-tough-to-beat" class="read-more">Read the rest</a></p>

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